Front-loading and rear-loading methods, compatible with docking station for improved operator efficiency and production cycle time
Internationally leading dual die bonding, dual dispensing, and dual wafer search systems
Direct-drive motor for bonding head operation
Linear motor driven wafer search platform (X/Y) and feed platform (B/C)
Automatic angle correction system for wafer frame
Automatic wafer ring loading/unloading system for enhanced production efficiency
Precision automation ensures improved production efficiency and reduced operational costs

Technical Specifications

Production Cycle	150ms (depends on chip size and bracket)
XY Accuracy	±1mil (±0.025mm)
Die Rotation	±3°
Die XY Workbench
Die Dimensions	3mil×3mil-80mil×80mil (0.076mm×0.076mm-2mm×2mm)
Max. Angle Correction	±15°
Max. Die Ring Size	6″ (152mm) outer diameter
Max. Die Area	4.7″ (119mm) after expansion
Resolution Ratio	0.04mil (1μm)
Thimble Z Height Stroke	80mil (2mm)
Image Recognition System
Grey Scale	256 (Level Grey)
Resolution	720(H)×540(V)(Pixels)
Die Bonder's Swing Arm-and-hand System
Swing Arm of Die Bonder	105° rotatable die bonding
Die Bond Pressure	Adjustable 30g-250g
Loading Workbench
Range of Stroke	500mm×120mm
XY Resolution	0.02mil (0.5μm)
Suitable Holder's Size
Length	300mm-500mm
Width	80mm-120mm
Facilities Needed
Voltage/Frequency	220V AC±5%/50HZ
Compressed Air	0.5MPa (MIN)
Rated Power	1200W
Gas Consumption	40L/min
Volume and Weight
Dimensions (L×W×H)	1900×980×1620mm
Weight	1200KG

Frequently Asked Questions

Is this machine easy to operate for first-time users?

An English manual and guide video are provided to demonstrate machine operation. For additional questions, contact us via email, Skype, phone, or our online trade manager service.

What if the machine has problems after delivery?

We provide free replacement parts during the warranty period. For parts under 0.5KG, we cover postage; for heavier parts, the customer pays shipping.

What is the minimum order quantity?

Minimum order is 1 machine, and mixed orders are welcome.

How can I purchase this machine?

Consult with us online or via email
Negotiate and confirm final price, shipping, and payment terms
Receive and confirm proforma invoice
Make payment as specified
We prepare your order after full payment confirmation
100% quality check before shipping
Delivery by air or sea

Why choose our company?

We are the actual manufacturers
Over ten years of experience in the machine industry
Commitment to high quality and timely delivery
24-hour after-sales support

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전자 생산 기계장치

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

모든 범주

픽 앤드 플레이스 기계

리플로우 오븐

SMT AOI 기계

SMT 솔더 페이스트 프린팅 기계

SMT SPI 기계

SMT 기계 라인

자동 삽입 기계

물결 용접 기계

PCB 로더 및 풀기

스엠티 컨베이어

접착제 디스펜싱 기계

컨포멀 코팅 기계

가열 오븐 기계

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전자 생산 기계장치

pcb 기계

Fully Automatic High Precision Flip Chip Die Bonder Machine with 150ms Cycle and ±1mil Accuracy for SMT Production Line

MOQ:	1
가격:	$28,000-28,500

상세 정보

제품 설명

상세 정보

무게:

1200kg

사이클 시간:

150명의 부인

XY 정확도:

±0.025mm

다이 회전:

± 3 °

다이 치수:

0.076mm*0.076mm-2mm*2mm

최대 각도 보정:

± 15 °

맥스 다이 링:

152mm

최대 다이 면적:

119mm

해상도 비율:

1μm

골무 스트로크:

2mm

회색 규모:

256

이미지 해상도:

720x540픽셀

다이 본드 압력:

30g-250g

XY 해상도:

0.5μm

정격 출력:

1200W

최소 주문 수량:

가격:

$28,000-28,500

강조하다:

150ms Cycle Die Bonder Machine

±1mil Accuracy Flip Chip Die Bonder Machine

±3° Die Rotation SMT Production Line Machine